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US Patent Issued to SAMSUNG ELECTRONICS on July 14 for "Semiconductor device" (South Korean Inventors)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,684,839, issued on July 14, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea). "Semiconductor device" was invented by Ki Hwa... Read More


US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on July 14 for "Semiconductor device with cap element" (Taiwanese Inventors)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,684,840, issued on July 14, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan). "Semiconductor device with cap e... Read More


US Patent Issued to GlobalFoundries U.S. on July 14 for "Gate structure on intrinsic base layer and overhanging lateral sidewall of intrinsic base layer" (American, Indian Inventors)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,684,841, issued on July 14, was assigned to GlobalFoundries U.S. Inc. (Malta, N.Y.). "Gate structure on intrinsic base layer and overhanging la... Read More


US Patent Issued to HYUNDAI MOTOR, KIA on July 14 for "Power semiconductor device and method for fabricating the same" (South Korean Inventor)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,684,842, issued on July 14, was assigned to HYUNDAI MOTOR COMPANY (Seoul, South Korea) and KIA Corp. (Seoul, South Korea). "Power semiconductor... Read More


US Patent Issued to IVWorks on July 14 for "III-N semiconductor structure and method of manufacturing same" (South Korean Inventor)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,684,843, issued on July 14, was assigned to IVWorks Co. Ltd. (Daejeon, South Korea). "III-N semiconductor structure and method of manufacturing... Read More


US Patent Issued to Infineon Technologies Austria on July 14 for "Semiconductor device and method of producing thereof" (Austrian, German Inventors)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,684,844, issued on July 14, was assigned to Infineon Technologies Austria AG (Villach, Austria). "Semiconductor device and method of producing ... Read More


US Patent Issued to HYUNDAI MOBIS on July 14 for "Power semiconductor device and method for manufacturing the same" (South Korean Inventor)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,684,845, issued on July 14, was assigned to HYUNDAI MOBIS Co. LTD. (Seoul, South Korea). "Power semiconductor device and method for manufacturi... Read More


US Patent Issued to Sumitomo Chemical on July 14 for "Multilayered substrate" (Japanese Inventor)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,684,846, issued on July 14, was assigned to Sumitomo Chemical Co. Ltd. (Tokyo). "Multilayered substrate" was invented by Yoshinobu Narita (Hita... Read More


US Patent Issued to NXP USA on July 14 for "Semiconductor device with a recessed field plate and method of fabrication therefor" (Arizona Inventors)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,684,847, issued on July 14, was assigned to NXP USA INC. (Austin, Texas). "Semiconductor device with a recessed field plate and method of fabri... Read More


US Patent Issued to Taiwan Semiconductor Manufacturing on July 14 for "Selective High-K formation in gate-last process" (Taiwanese Inventors)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,684,848, issued on July 14, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "Selective High-K formation in gate-... Read More